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Samsung/HANWHA NEW DECAN S1 SMT PICK&PLACE MACHINE

Samsung/HANWHA NEW DECAN S1 SMT PICK&PLACE MACHINE

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    HANWHA SMT PICK&PLACE MACHINE

    ,

    Samsung SMT PICK&PLACE MACHINE

  • BRAND
    HANWHA
  • Model
    DECAN S1
  • Automatic /Manual
    Automatic
  • Chip Speed
    47000CPH(max)
  • Mounter Weight
    1600kg
  • Mounter Size
    1,430(L) X 1,740(D) X 1,485(H)
  • Placement Accuracy
    ±28μm
  • Number Of Mounting Shafts
    10 Spindles
  • PCB Thickness
    0.38-4.2mm
  • Power Supply
    AC 200/208/220/240/380/415V(50/60Hz 3Phase)Max 5.0KVA
  • Pressure
    0.5-0.7MPa(5- 7kgt/cm2) 350NL/min , 50NL/min
  • Place of Origin
    Korea
  • Brand Name
    Samsung/HANWHA
  • Certification
    CE-HANWHA
  • Model Number
    DECAN S1
  • Minimum Order Quantity
    1
  • Price
    negotiation
  • Packaging Details
    Woodenbox
  • Delivery Time
    1-2 work days
  • Payment Terms
    T/T,Western Union,paypal
  • Supply Ability
    10pcs/day

Samsung/HANWHA NEW DECAN S1 SMT PICK&PLACE MACHINE

The following is a detailed summary and analysis of the performance characteristics of the Hanwha Samsung DECAN S1 SMT machine, highlighting its core advantages and technical highlights:

 

1. Best performance in the same class: ultralarge PCB processing capacity


DECAN S1 has industryleading PCB processing capacity in the field of mediumspeed SMT machines, and supports the following specifications:
Standard size: 510mm × 510mm, suitable for most conventional PCB production needs.
Expansion options: It can support ultralarge PCB boards of up to 1,500mm (length) × 460mm (width), suitable for long strips or specialsized circuit boards (such as LED light strips, industrial control boards, etc.).
Advantages:
Significantly reduce the number of steps for depaneling large PCBs and improve singleboard production efficiency.
Adapt to the flexible production needs of multivariety and largesize products and reduce the frequency of line changes.

 

2. Stable microchip mounting: reduce the material throwing rate and improve the yield rate


DECAN S1 has made many optimizations for the stability of microchip mounting:
Precise identification of nozzle center: Realtime detection of nozzle position by highprecision sensor to avoid mounting errors caused by offset.
Antileakage design: Optimize the air pressure control system to reduce component falling or material throwing problems caused by vacuum leakage.
Improvement of material throwing rate: Through the coordinated optimization of hardware and algorithms, the material throwing rate of microchips (such as 0201, 01005) is reduced to the industryleading level, improving material utilization.
Advantages:
Ensure the mounting consistency of tiny components, especially suitable for highdensity PCB production such as smartphones and wearable devices.
Reduce downtime adjustment time and improve overall production efficiency.

 

3. Highprecision visual system: Expanded recognition range and efficiency


DECAN S1 is equipped with upgraded visual recognition technology, which significantly improves placement flexibility and speed:
(1) Highpixel Fly Camera
Expanded recognition range: Supports fullsize coverage from 03015 micro components (0.3mm×0.15mm) to 16mm large components, and can meet diverse needs without changing the camera.
OntheFly technology: Components are recognized at high speed during movement, reducing pause time and improving placement rhythm.

(2) Intelligent collaboration of feeders
Automatic alignment of material slots: The device communicates with the feeder in real time, automatically calibrates the position of the material belt, and ensures suction accuracy.
Advantages:
Reduce manual intervention, improve the "simultaneous suction rate" of multiple types of components, and reduce placement waiting time.

(3) Optimization of mounting of specialshaped components
Fix Camera recognition process optimization: The recognition order of specialshaped components (such as connectors and shielding covers) is adjusted through algorithms, and the mounting speed is increased by 25%.
Application scenarios:
Accelerate the production cycle of specialshaped components in automotive electronics and industrial control equipment.

 

4. Intelligent calibration and maintenance: Ensure longterm stability


DECAN S1 introduces a number of intelligent functions to ensure the continuous stability of accuracy and quality during the production process:
(1) Automatic calibration during operation (Run Time Calibration)
Dynamic compensation mechanism: Automatically execute the calibration procedure during the production process to compensate for the accuracy deviation caused by temperature changes or mechanical wear in real time.
Advantages:
The mounting accuracy (±25μm@Cpk≥1.0) can be maintained without stopping the machine, which is especially suitable for factories with 24hour continuous production.

(2) Auto Maintenance System
Preventive Maintenance: Regularly detect the air pressure and flow parameters of the nozzle and shaft to warn of potential failures in advance.
Highpressure purge cleaning: Automatically remove foreign matter in the nozzle and shaft to avoid poor absorption due to blockage.
Advantages:
Reduce the frequency of manual maintenance, reduce downtime, and extend the life of key components.

 

Summary: DECAN S1's core competitiveness


1. Balance between efficiency and precision: Achieve highspeed placement performance (up to 100,000 CPH) in mediumspeed machines while maintaining micronlevel precision.
2. Flexible adaptation to complex needs: Ultralarge PCB compatibility, fullsize component support, and intelligent feeding system to facilitate multivariety mixedline production.
3. Intelligent production guarantee: Dynamic calibration and automatic maintenance technology significantly improve the overall equipment efficiency (OEE).

 

Applicable scenarios:


Medium and largevolume production in the fields of consumer electronics, automotive electronics, industrial control, etc.
Highend manufacturing scenarios with high requirements for component diversity and mounting stability.

Through technological innovation and practical design, DECAN S1 has become a reliable choice for electronic manufacturing companies to improve production capacity and yield.

Samsung/HANWHA NEW DECAN S1 SMT PICK&PLACE MACHINE 0

DECAN S1 Specifications

Alignment     Fly Camera + Fix Camera
The Number of Spindles     10 spindles x 1 Gantry
Placement Speed
(Optimum)
    47,000 CPH (Optimum)
Placement
Accuracy
Chip   ±28μm @ Cpk≥ 1.0
IC   ±35μm @ Cpk≥ 1.0
Component
Range
Fly Camera   03015 ~ □16mm
Fix Camera   ~ □42mm (Standard)
□42mm ~ □55mm (MFOV)
L55mm ~ L75mm Connector (MFOV)
Max. Height   10mm (Fly), 15mm (Fix)
PCB Size (mm) Min.   50(L) x 40(W)
Max. Standard 510(L) x 510(W)
Option ~ Max. 1,500(L) x 460(W)
PCB Thickness (mm)     0.38 ~ 4.2
Feeder Capacity
(8 mm Standard)
  Standard 60ea / 56ea (Fixed feederbase / Docking Cart)
Option 120ea / 112ea (Fixed feederbase / Docking Cart)
Utility power   3Phase AC200 / 208 / 220 / 240 / 380 / 415V
Max. 3.5kVA
Air
Consumption
  5.0~7.0kgf/cm2
50Nℓ/min (Vacuum Pump)
Weight (kg)     Approx. 1,600
External Dimension (mm)     1,430(L) x 1,740(D) x 1,485(H)

 

 

 

 

Samsung/HANWHA NEW DECAN S1 SMT PICK&PLACE MACHINE 1

 

KEYWORDS:

 

 

Samsung/HANWHA NEW DECAN S1 SMT PICK&PLACE MACHINE 2

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We can do for you:
1. We provide fulL SMT solution for you
2. We provide core technology with our equipments
3. We provide the most professional tech service
4. We have wealthy experience on SMT factory setup
5. We can solve any question about SMT

 

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